NimbleAI: Towards Neuromorphic Sensing-Processing 3D-integrated Chips
Résumé
This article introduces the Horizon Europe NimbleAI research project, which brings together 19 EU and UK partners covering most of the semiconductor value chain. NimbleAI leverages key principles of energy-efficient visual sensing and processing in biological eyes and brains, and harnesses the latest advances in 3D stacked silicon integration, to create an integral sensing-processing neuromorphic architecture that efficiently and accurately runs computer vision algorithms in area-constrained endpoint chips.
The rationale behind the NimbleAI architecture is to sense data only with high information value and discard data as soon as they are found not to be useful for the application (in a given context). The NimbleAI sensing-processing architecture is to be specialized after-deployment by tuning system-level trade-offs for each particular computer vision algorithm and deployment environment.
The objectives of NimbleAI are:
1. Achieve 100x performance per mW gains compared to state-of-the-practice solutions (i.e., CPU/GPUs processing frame-based video).
2. Reduce processing latency by 50x compared to CPU/GPUs.
3. Achieve energy consumption in the order of tens of mWs.
4. Occupy silicon area of approximately 50 mm².
Domaines
Architectures Matérielles [cs.AR]
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